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| MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by DTA114YE/D Preliminary Data Sheet Bias Resistor Transistor DTA114YE 3 2 1 PNP Silicon Surface Mount Transistor with Monolithic Bias Resistor Network The BRT (Bias Resistor Transistor) contains a single transistor with a monolithic bias network consisting of two resistors; a series base resistor and a base-emitter resistor. These digital transistors are designed to replace a single device and its external resistor bias network. The BRT eliminates these individual components by i n t e g r a t i n g t h e m i n t o a s i n g l e d e v i c e . T h e D TA 11 4 Y E i s h o u s e d i n t h e SOT-416/SC-90 package which is ideal for low-power surface mount applications where board space is at a premium. * Simplifies Circuit Design * Reduces Board Space * Reduces Component Count * Available in 8 mm, 7 inch/3000 Unit Tape and Reel. IN (1) R1 R2 CASE 463-01, STYLE 1 SOT-416/SC-90 OUT (3) GND (2) R1 = 10 k R2 = 47 k MAXIMUM RATINGS (TA = 25C unless otherwise noted) Rating Output Voltage Input Voltage Output Current Symbol VO VI IO Value - 50 -40 -100 Unit Vdc Vdc mAdc DEVICE MARKING DTA114YE = 59 THERMAL CHARACTERISTICS Power Dissipation @ TA = 25C(1) Operating and Storage Temperature Range Junction Temperature PD TJ, Tstg TJ *125 - 55 to +150 150 mW C C ELECTRICAL CHARACTERISTICS (TA = 25C) Characteristic Input Off Voltage (VO = -5.0 Vdc, IO = -100 Adc) Input On Voltage (VO = -0.3 Vdc, IO = -1.0 mAdc) Output On Voltage (IO = -5.0 mAdc, II = -0.25 mAdc) Input Current (VI = -5.0 Vdc) Output Cutoff Current (VO = - 50 Vdc) DC Current Gain (VO = -5.0 Vdc, IO = -5.0 mAdc) Input Resistance Resistance Ratio Symbol VI(off) VI(on) VO(on) II IO(off) GI R1 R1/R2 Min -- -1.4 -- -- -- 68 7.0 0.17 Typ -- -- -- -- -- -- 10 0.21 Max -0.3 -- -0.3 -0.88 -500 -- 13 0.25 Unit Vdc Vdc Vdc mAdc nAdc -- kOhms 1. Device mounted on a FR-4 glass epoxy printed circuit board using the minimum recommended footprint. This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice. Thermal Clad is a trademark of the Bergquist Company REV 1 Motorola Small-Signal Transistors, FETs and Diodes Device Data (c) Motorola, Inc. 1996 1 DTA114YE TYPICAL ELECTRICAL CHARACTERISTICS 1 G I , DC CURRENT GAIN (NORMALIZED) IO/II = 10 VO(on), OUTPUT VOLTAGE (V) TA = -25C 25C 0.1 75C 180 160 140 120 100 80 60 40 20 0 1 2 4 6 8 10 15 20 40 50 60 70 IO, OUTPUT CURRENT (mA) 80 90 100 -25C VO(on) = 10 V 25C TA = 75C 0.01 0.001 0 20 40 60 IO, OUTPUT CURRENT (mA) 80 Figure 1. VO(on) versus IO Figure 2. GI, DC Current Gain 100 TA = 75C IO, OUTPUT CURRENT (mA) 25C V I , INPUT VOLTAGE (VOLTS) 10 VO = 0.2 V 25C TA = -25C 75C 1 -25C 10 VO = 5 V 1 0 2 4 6 VI, INPUT VOLTAGE (V) 8 10 0.1 0 10 20 30 IO, OUTPUT CURRENT (mA) 40 50 Figure 3. Output Current versus Input Voltage Figure 4. Input Voltage versus Output Current 4.5 4 Cob , CAPACITANCE (pF) 3.5 3 2.5 2 1.5 1 0.5 0 0 2 4 6 8 10 15 20 25 30 35 40 VR, REVERSE BIAS VOLTAGE (VOLTS) 45 50 f = 1 MHz lE = 0 V TA = 25C +12 V Typical Application for PNP BRTs LOAD Figure 5. Output Capacitance Figure 6. Inexpensive, Unregulated Current Source 2 Motorola Small-Signal Transistors, FETs and Diodes Device Data DTA114YE MINIMUM RECOMMENDED FOOTPRINTS FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. 0.5 min. (3x) TYPICAL SOLDERING PATTERN 0.5 min. (3x) Unit: mm 1.4 SOT-416/SC-90 POWER DISSIPATION The power dissipation of the SOT-416/SC-90 is a function of the pad size. This can vary from the minimum pad size for soldering to the pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RJA, the thermal resistance from the device junction to ambient; and the operating temperature, TA. Using the values provided on the data sheet, PD can be calculated as follows: PD = TJ(max) - TA RJA the equation for an ambient temperature TA of 25C, one can calculate the power dissipation of the device which in this case is 125 milliwatts. PD = 150C - 25C = 125 milliwatts 1000C/W The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into The 1000C/W assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 125 milliwatts. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal CladTM. Using a board material such as Thermal Clad, a higher power dissipation can be achieved using the same footprint. SOLDERING PRECAUTIONS The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. * Always preheat the device. * The delta temperature between the preheat and soldering should be 100C or less.* * When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10C. * The soldering temperature and time should not exceed * When shifting from preheating to soldering, the * After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling. maximum temperature gradient should be 5C or less. 260C for more than 10 seconds. * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. Motorola Small-Signal Transistors, FETs and Diodes Device Data EEE EEE EEE EEE EEE EEE 0.5 EEE EEE EEE 1 3 DTA114YE SOLDER STENCIL GUIDELINES Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste onto the footprint. The stencil is made of brass or stainless steel with a typical thickness of 0.008 inches. The stencil opening size for the surface mounted package should be the same as the pad size on the printed circuit board, i.e., a 1:1 registration. TYPICAL SOLDER HEATING PROFILE For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones, and a figure for belt speed. Taken together, these control settings make up a heating "profile" for that particular circuit board. On machines controlled by a computer, the computer remembers these profiles from one operating session to the next. Figure 7 shows a typical heating profile for use when soldering a surface mount device to a printed circuit board. This profile will vary among soldering systems but it is a good starting point. Factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. This profile shows temperature versus time. The line on the graph shows the actual temperature that might be experienced on the surface of a test board at or near a central solder joint. The two profiles are based on a high density and a low density board. The Vitronics SMD310 convection/infrared reflow soldering system was used to generate this profile. The type of solder used was 62/36/2 Tin Lead Silver with a melting point between 177 -189C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints. STEP 1 PREHEAT ZONE 1 "RAMP" 200C STEP 2 STEP 3 VENT HEATING "SOAK" ZONES 2 & 5 "RAMP" STEP 5 STEP 4 HEATING HEATING ZONES 3 & 6 ZONES 4 & 7 "SPIKE" "SOAK" 170C 160C STEP 6 STEP 7 VENT COOLING 205 TO 219C PEAK AT SOLDER JOINT DESIRED CURVE FOR HIGH MASS ASSEMBLIES 150C 150C 140C SOLDER IS LIQUID FOR 40 TO 80 SECONDS (DEPENDING ON MASS OF ASSEMBLY) 100C 100C DESIRED CURVE FOR LOW MASS ASSEMBLIES 50C TIME (3 TO 7 MINUTES TOTAL) TMAX Figure 7. Typical Solder Heating Profile 4 Motorola Small-Signal Transistors, FETs and Diodes Device Data DTA114YE PACKAGE DIMENSIONS -A- S 2 3 STYLE 1: PIN 1. BASE 2. EMITTER 3. COLLECTOR NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. DIM A B C D G H J K L S MILLIMETERS MIN MAX 0.70 0.80 1.40 1.80 0.60 0.90 0.15 0.30 1.00 BSC --- 0.10 0.10 0.25 1.45 1.75 0.10 0.20 0.50 BSC INCHES MIN MAX 0.028 0.031 0.055 0.071 0.024 0.035 0.006 0.012 0.039 BSC --- 0.004 0.004 0.010 0.057 0.069 0.004 0.008 0.020 BSC G -B- 1 D 3 PL 0.20 (0.008) M B K 0.20 (0.008) A J C L H CASE 463-01 ISSUE A SOT-416/SC-90 Motorola Small-Signal Transistors, FETs and Diodes Device Data 5 DTA114YE Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. How to reach us: USA / EUROPE / Locations Not Listed: Motorola Literature Distribution; P.O. Box 20912; Phoenix, Arizona 85036. 1-800-441-2447 or 602-303-5454 MFAX: RMFAX0@email.sps.mot.com - TOUCHTONE 602-244-6609 INTERNET: http://Design-NET.com JAPAN: Nippon Motorola Ltd.; Tatsumi-SPD-JLDC, 6F Seibu-Butsuryu-Center, 3-14-2 Tatsumi Koto-Ku, Tokyo 135, Japan. 03-81-3521-8315 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852-26629298 6 DTA114YE/D Motorola Small-Signal Transistors, FETs and Diodes Device Data *DTA114YE/D* |
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